Notes: POET Technologies - The Optical Interposer Thesis
POET’s Optical Interposer replaces costly active alignment with wafer-level pick-and-place packaging, opening AI optical engines to high-volume CMOS-scale manufacturing.
Notes: The Bottleneck Heuristic — Blackwell's Gauntlet, the ASIC Breakout, and the Optical Chokepoint (Pt.2)
Blackwell’s packaging, cooling, NVL72, and on-chip SFU bottlenecks exposed NVDA’s gauntlet — while Google’s AVGO-designed TPUv7 shattered the ASIC skepticism and the optical chokepoint tightened into 2025’s defining constraint.
Notes: The Bottleneck Heuristic - Where Scarcity Meets Capability in the AI Value Chain (Pt.1)
The investment framework that separates signal from noise: where critical supply scarcity collides with AI’s exploding capability demand to create durable pricing power and mispriced opportunities across the value chain.
SysMoore & Energy (Pt.3.2) Reactor Design & Fuel
Industrialized modular SMR manufacturing is the only viable path to meet AI-driven nuclear demand — but advanced coolants, HALEU fuel, and TRISO fabrication bottlenecks will decide which designs (and which public companies) actually scale.
SysMoore & Energy (Pt.3.1) Nuclear Landscape
The post-nuclear-winter global landscape: decades of underinvestment left the industry dormant just as AI’s insatiable power demand arrives, setting up the policy, supply-chain, and technology gaps that define the next decade’s nuclear investment thesis.
SysMoore & Energy (Pt.3)
SysMoore’s hardware renaissance meets the energy wall — how AI compute’s explosive growth is forcing a fundamental rethink of power infrastructure, unlocking nuclear and natural gas tailwinds amid persistent buildout constraints.
Notes: ASM and the Rising Complexity of Chips & Why ALD Matters More Than Ever
Summary
* Semiconductor scaling is shifting from lithography alone to materials precision and 3D architectures, structurally increasing ALD intensity where ASM is strongest.
* The transition to GAA, backside power delivery, and 2nm-class nodes creates a multi-year growth cycle driven by process complexity rather than wafer volume.
* AI-driven demand