Huawei After Sanctions: CIDM, Kirin 9050, and Logic Folding (Pt.1)
US sanctions bought time, not a lead. Huawei’s CIDM now ships Kirin 9050 with 1.5 µm wafer-to-wafer bonds — about 6× finer than TSMC SoIC. A coarse bond stacks two chips. A fine bond folds one circuit: two wafers, one netlist, one chip.