A fine hybrid bond does not stack two chips. It folds one circuit across two wafers.

Huawei

Huawei After Sanctions: CIDM, Kirin 9050, and Logic Folding (Pt.1)

13 min · 10 Sep 2026

US sanctions bought time, not a lead. Huawei’s CIDM now ships Kirin 9050 with 1.5 µm wafer-to-wafer bonds — about 6× finer than TSMC SoIC. A coarse bond stacks two chips. A fine bond folds one circuit: two wafers, one netlist, one chip.

4Q26 Portfolio Rebalance: Positioning for a Shift in AI Infrastructure Leadership (Pt.2)

Customers are redesigning around tight chips, memory, optics and power. We increased Cerebras to 1% and SPCX to 4%, and we trimmed Soitec to 3.5% and POET to 0.75%.

42 min read 29 Oct 2026

10 min read 23 Oct 2026

Nvidia at 16x Earnings: MSU Analysis vs. Broadcom (Pt.3)

Nvidia trades at its lowest multiple since 2015. We compare our view with the Market’s and the Street’s, and explain why a shrinking moat makes Nvidia a possible value trap and Broadcom, at similar multiples, the stronger case.

19 min read 20 Oct 2026

Nvidia at 16x Earnings: Bargain or Value Trap? (Pt.2)

Nvidia’s margins are safe for now. We look at who really profits from the AI chip shortage, why Nvidia is now guaranteeing its customers’ data centers, where it lags on optics, and why 2028–2029 is the real test for its prices.

Read next