Summary * In Part 2 of the SysMoore series we compare the different approaches to chip-level packaging between Intel and AMD. * We also discuss PCBs, as scaling at the chip level reaches physical limits, PCBs are becoming essential for enabling high-speed, high-density connections necessary for advanced AI and data center workloads. * Additionally we consider what's happening to scale compute at the server/rack level, outlining how Nvidia plans to implement its upcoming GB200 architecture wi