Huawei After Sanctions: CIDM, Kirin 9050, and Logic Folding (Pt.3)
Two tiers of a folded chip joined by short, glowing vertical bonds: the trip that replaces a long journey across the silicon.

Huawei After Sanctions: CIDM, Kirin 9050, and Logic Folding (Pt.3)

Huawei’s new phone chip is more than a sanctions workaround: it points to another way to improve chips when shrinking transistors gets harder. The bigger test is AI, where the same ideas could cut data-movement costs and make Huawei’s NPUs a serious challenge to NVIDIA.