Arm IPO - Tough Situations, Priced To Perfection (Pt.2)

AI spending keeps growing, but the winners are changing. Our 4Q26 rebalance favors Broadcom over NVIDIA and backs suppliers enabling logic folding and optical integration. We also explore Tesla’s physical AI opportunity and the risks to TSMC’s long-term dominance.

Cut off from EUV, Huawei is scaling a different way: folding two chips face to face so signals travel down rather than across. Part 2 explains why that raises clock speed without shrinking transistors, how the design repairs its own defects, and where the real wall lies.

US sanctions bought time, not a lead. Huawei’s CIDM now ships Kirin 9050 with 1.5 µm wafer-to-wafer bonds — about 6× finer than TSMC SoIC. A coarse bond stacks two chips. A fine bond folds one circuit: two wafers, one netlist, one chip.