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Huawei After Sanctions: CIDM, Kirin 9050, and Logic Folding (Pt.2)
Cut off from EUV, Huawei is scaling a different way: folding two chips face to face so signals travel down rather than across. Part 2 explains why that raises clock speed without shrinking transistors, how the design repairs its own defects, and where the real wall lies.
Huawei After Sanctions: CIDM, Kirin 9050, and Logic Folding (Pt.1)
US sanctions bought time, not a lead. Huawei’s CIDM now ships Kirin 9050 with 1.5 µm wafer-to-wafer bonds — about 6× finer than TSMC SoIC. A coarse bond stacks two chips. A fine bond folds one circuit: two wafers, one netlist, one chip.
SpaceX - Powering AI from Orbit: Sizing the Opportunity (Pt.6)
SPCX is now the ultimate AI data-center and energy play. At ~$2.4T and ~80x forward sales, its valuation rests almost entirely on Space Data Center execution — where Starship, solar, and custom silicon could unlock a path toward $20T.